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Ir. Dr. Mohd. Zulkifly Abdullah

Position Professor
Academic Qualification B. Eng. (Swansea), M.Sc (Strath), Ph.D (Strath)
Professional Membership
Area of Expertise Electronic Packaging in 3D packaging and TSV
  Advanced electronic cooling for high heat flux
  Porous medium burner for domestic applications
   
  Research gate
 

Contact Info


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Tel. No. (Office) : 04 5996310
Tel. No. (Personal) : 
Room No. :

Publication



UNIVERSITY BOOK 

1. Zoeb Husain, Mohd Zulkifly Abdullah, Zainal Alimuddin, 2008, Basic Fluid Mechanics and Hydraulic Machines, BS Publication, 234 

INVITED BOOK CHAPTERS 

1. Combustion in porous inert media, Combustion Synthesis - Novel Routes to Novel Materials, Bentham Science Publishers Ltd., (eISBN:978-1-60805-155-7 doi: 10.2174/978160805155711001010195), 2010, Vol 1, Chapter 15, pp.195-205.

2. Applications of Porous Media Combustion Technology, To be included in the proposed review book “Colloids in the Environment Protection”, Research Signpost Publishers, 2010 (submitted).

3. Renewable, sustainable and Eco-energy, CFD Applications in Energy and Environment Sectors, International Energy and Environment Foundation (IEEF), 2011 (submitted) 

PAPERS IN INTERNATIONAL/LOCAL JOURNALS

1. Z. Husain, Z. Alimuddin, Z. Abdullah, ‘Briquetting of Palm Fibre and Shell from the processing of palm nuts to palm oil’, Int. Journal of Biomass and Bioenergy, 22(6), 2002, pp. 505-509, (ISI IF= 1.77)

2. Z. Husain, Z. Alimuddin and M. Zulkifly, ‘Analysis of Biomass-Residue-Based Cogeneration System in Palm Oil Mills’, Int. Journal of Biomass and Bioenergy, 24(2), 2003, pp.117-124, (ISI IF= 1.77) 

3. M. Z. Abdullah, Z. Husain and S. L. Yin Pong, ‘Analysis of Cold Flow Fluidization Test Results for Various Biomass Fuels’, Int. Journal of Biomass and Bioenergy, 24, 2003, pp.487-494, (ISI IF= 1.77) 

4. Fraser, S. M., Abdel Razak, A. M. and Abdullah, M. Z., ‘Computational and Experimental Investigation in a Cyclone Dust Separator’, Proc. Instn. Mechanical Engrs., 1997, Vol. 211, Part E, pp. 247-257 (ISI IF= 0.463). 

5. K. O. Lim, Z. A. Zainal Alauddin, G. A. Quadir and M. Z. Abdullah ‘Plant Based Energy Potential and Biomass Utilization in Malaysia’, Int. Energy Journal, Vol. 1, No. 2, December 2000, (ISI IF= 1.726) 

6. K. O. Lim, Z. A. Zainal Alauddin, G. A. Quadir and M. Z. Abdullah ‘Energy Potential and Utilization of Plantation Crops in Malaysia’, ASEAN Journal on Science and Technology for Development, Vol.17, No. 2, pp. 1-16, December 2000. 

7. M. Z. Abdullah, Y. C. Yau and Z. A. Zainal Alauddin, ’Effect of pressure on thermal contact resistance for rough mating surfaces’, ASEAN Journal on Science and Technology for Development, Vol.18, No. 2, December 2001. 

8. A. Jaafar, Z. Husain, Z. Mohd Ripin, M. Z. Abdullah, R. Ahmad ‘Aerodynamic Characteristics of Canard, Wing of Low Speed Aircraft’, Journal of Institute of Engineers Malaysia, 62, 2, pp 3-7, 2001. 

9. Z. Husain, M. Z. Abdullah and T. C. Yap, ‘CFD 2-Dimensional Analysis of Tandem/Staggered Arranged Airfoils’, Int. J. of Mechanical Engineering Education, Vol. 33 (3), July 2005, pp. 195-207. 

10. M. Z. Abdullah, Z. Husain, T. C. Yap and S. M. Fraser, ‘Application of Deswirl Blade in Cyclone Dust Separator’, Journal of Institute of Engineers Malaysia, Vol. 63 (2), 2002, pp. 25-34. 

11. M. Z. Abdullah, Z. Husain, T. C. Yap and S. M. Fraser, ‘Application of Deswirl Device in Cyclone Dust Separator’, ASEAN Journal on Science and Technology for Development, Vol. 20(3&4), March 2003, pp. 203-216. 

12. Z. Husain, M. Z. Abdullah, T. C. Yap and M. Y. Idroas, ‘Effect of Free Stream Turbulence on The Performance of NACA 0015 Airfoil’, ASEAN Journal on Science and Technology for Development, Vol. 20(2), June 2003, pp. 117-124. 

13. M. Z. Abdullah, Z. Mohd Ali, Z. Husain, ‘Aerodynamic Performance of a Remotely Piloted Vehicle’, Journal of Institute of Engineers Malaysia, 66(4), December 2005. 

14. B. Jayakumar, G. A. Quadir, M. Z. Abdullah and K. N. Seetharamu, ‘Three Dimensional CFD Conjugate Analysis of Two Inline PLCC package Horizontally Mounted’, Int. J. of Microelectronics and Packaging Society, 28 (4), 4th Qtr, 2004. 

15. Mohd. Zulkiefly Abdullah, T. Kouta, Takuma Kamijo, Makoto Yamamoto, Shinji Honami and Shoji Kamiuten, ‘Numerical Investigation on Bottom Gap of Micro Flow Sensor’, Journal of Computational Fluid Engineering, Vol. 10(1), March 2005, pp. 73-79. 

16. K. A. Ahmad, M. Z. Abdullah and J. K. Watterson, ‘CFD Simulation of Oscillating Sub-boundary layer Vortex Generators for Diffuser Flow Separation Control’, Int. Journal of Engineering and Technology (IN PRESS) 

17. D. H. Hussein, H. Gitano-Briggs and M. Z. Abdullah, Design Analysis and Performance Prediction of the Cardiac Axial Blood Pump, Research Journal of Biological Sciences, Vol. 4 (6), pp. 637-643, 2009. 

18. D. H. Hussein, H. Gitano-Briggs and M. Z. Abdullah, Cardiac Axial Blood Pump Analysis and Performance Prediction, ASME: Journal of Medical Devices, Vol. 3, June 2009. 

19. M. K. Abdullah, M. Z. Abdullah, S. Kamaruddin and Z. M. Ariff. Three-dimensional mold flow in stacked-chip scale packages (S-CSP), Int. Com. In Heat and Mass Transfer, 34, 2007, pp. 820-828, (ISI IF= 1.332) 

20. M. A. Ismail, M. Z. Abdullah and M. A. Mujeebu, CFD-Based Experimental Analysis on the Effect of Free Stream Cooling on the Performance of Micro Processor Heat Sinks, Int. Comm. Heat Mass Transfer, Volume 35, Issue 6, July 2008, pp. 771-778, (ISI IF= 1.332) 

21. M. A. Mujeebu, S. Jayaraj, S. Ashok, M. Z. Abdullah and M. Khalil (2008). Feasibility Study of Cogeneration in a Plywood Industry with Power Export to Grid, Applied Energy, Volume 86, Issue 5, May 2009, pp 657 – 662, (ISI IF= 1.371) 

22. M.Khalil Abdullah, M. Z. Abdullah, M.A. Mujeebu, S. Kamaruddin and Z. M. Ariff (2008). A Study on the Effect of Epoxy Moulding Compound (EMC) Rheology during Encapsulation of Stacked-Chip Scale Packages (S-CSP). Journal of Reinforced plastic & Composites, Volume 28, Number 20, 2009, pp 2527-2538, (ISI IF= 0.573) 

23. M.K. Abdullah, M. Z. Abdullah, C. Y. Khor, Y. Ooi, M. V. Ramana, K. A. Ahmad, M. A. Mujeebu and Z. Mohd Ripin (2008). Effect of Piezoelectric Fan Height on Flow and Heat Transfer for Microelectronic Cooling Applications, International Communications in Heat and Mass Transfer, Volume 36, Issue 1, January 2009, pp 51-58, (ISI IF= 1.332) 

24. C. S. Ramesh, R. Noor Ahmed, M. A. Mujeebu, M. Z. Abdullah, Fabrication and Study on Tribological Characteristics of Cast Copper-TiO2- Boric acid hybrid Composites, Journal of material design, Volume 30, Issue 5, May 2009, pp 1632-1637, (ISI IF= 1.107) 

25. C S Ramesh, R Noor Ahmed, M A Mujeebu, M Z Abdullah, Development and Performance Analysis of Novel Cast Copper-SiC-Gr hybrid Composites, J Material Design, Volume 30, Issue 6, June 2009, pp 1957 – 1965, (ISI IF= 1.107) 

26. M.A Mujeebu, M.Z Abdullah, M.Z Abu Bakar, R.M.N Muhad, M. Khalil (2008). Combustion in porous media and its applications- A comprehensive survey, Journal of Environmental Management, Volume 90, Issue 8, June 2009, pp 2287 – 2312. (ISI IF= 1.109). 

27. M.A Mujeebu, M.Z Abdullah, M.Z Abu Bakar, M. Khalil (2008). A Review of investigations on liquid fuel combustion in porous inert media, Progress in Energy and Combustion Science, Volume 35, Issue 2, April 2009, pp 216 – 230. (ISI IF= 11.2). 

28. Hegde Pradeep, Seetharamu, K.N., Aswatha Narayana, P.A., Quadir, G. A., and Abdullah M.Z. Thermal Analysis of Micro-channel Heat Exchangers with Two Phase Flow using FEM. Int. J. Num. Methods for Heat & Fluid Flow, 15(1), 2005, pp. 43-60, (ISI IF= 0.685) 

29. Hegde Pradeep, Seetharamu, K.N., Aswatha Narayana, P.A. and Abdullah Zulkifly. (2005). Two-Phase Stacked Micro channel Heat Sinks for Microelectronics Cooling. IMAPS-Journal of Microelectronics and Electronic Packaging. 2(2):122-131. 

30. Hegde Pradeep, Abdullah. M. Z., Seetharamu, K.N., Aswatha Narayana, P.A. Counter and Parallel Two-Phase Flow Micro channel Heat Sinks for Electronics Cooling. International Journal of Heat Exchangers 2006; Vol. VII, pp. 57-14. 

31. Hegde Pradeep, Abdullah. M.Z., Hassan, A.Y. and Seetharamu, K.N. Artificial Neural Network Trained One Dimensional FEM Model to Predict Two Phase Flow Characteristics in Mini/Micro Channels. International Journal of Heat Exchangers 2007; Vol VIII, pp.1-14. 

32. M. V. Ramana, I. P. Almanar, M. Z. Abdullah, Z. Mohd Ripin and K. N. Seetharamu, Design and optimization of piezoelectric fans cooling of microelectronics devices, Int. Journal of Microelectronics and Packaging Society, 4 (3), 3rd Qtr, 2007. 

33. M.Khalil Abdullah, M. Z. Abdullah, M.A. Mujeebu, S. Kamaruddin and Z. M. Ariff (2008). A Study on the Effect of Stack Thickness during Encapsulation of Stacked-Chip Scale Packages (S-CSP). Int. Journal of Microelectronics & Packaging 2008; vol. 5 (2) pp. 62-67

34. Mazlan Mohamed, Rasdi Deraman, M.Z. Abdullah, M.A. Mujeebu, M. K. Abdullah, Three-Dimensional CFD Simulation for 8 PLCC Packages Mounted in Line on a Printed Circuit Board, ESTEEM, (Journal published by UiTM, Malaysia) Vol. 4 (1), 2008. 

35. M. Abdul Mujeebu, M.Z, Abdullah, M.Z Abu Bakar, A.A Mohamad, M.K. Abdullah, Applications of Porous Media Combustion Technology – A Review, Applied Energy, Volume 86, 2009, pp 1365-1375, (ISI IF= 1.731). 

36. S. Yusoff, M. Mohamad, K.A. Ahmad, M.Z. Abdullah, M.A Mujeebu, Z. Mohd Ali, F. Idrus, Y. Yaakob, 3-D Conjugate Heat Transfer Analysis of PLCC Packages Mounted In-line on a Printed Citcuit Board, Int. Communications in Heat and Mass Transfer, Volume 36, Issue 8, October 2009, pp 813-819, (ISI IF= 1.332). 

37. C.Y.Khor, M. Abdul Mujeebu, M. Z. Abdullah, F. Che Aini, Finite Volume based CFD Simulation of Pressurized Flip-chip Underfill Encapsulation Process, Microelectrinics Reliability, Vol. 50, pp. 98-105, 2010 (ISI IF= 1.4). 

38. C.Y. Khor, Z.M. Ariff, F. Che Aini, M. Abdul Mujeebu, M. K. Abdullah, M. Z. Abdullah, M. A. Joseph, Three-dimensional Numerical and Experimental Investigations on Polymer Rheology in Meso-scale Injection Molding, Int. Communications in Heat and Mass Transfer, Vol. 37, pp. 131-139, 2010 (ISI IF= 1.332). 

39. C.Y. Khor, Z.M. Ariff, F. Che Aini, M. Abdul Mujeebu, M. K. Abdullah, M. Z. Abdullah, FVM Based Numerical Study on The Effect of Solder Bump Arrangement on Capillary Driven Flip Chip Underfill Process, Int. Communications in Heat and Mass Transfer, Vol. 37, pp. 281-286, 2010 (ISI IF= 1.332). 

40. M. A. Mujeebu, M. Z. Abdullah, M. Z. Zakaria , A. A. Mohamed, Mesoscale Premixed LPG Burner with Surface Combustion in Porous Ceramic Foam, Energy Sources, Part A: Recovery, Utilization and Environmental Effects, Vol. 34, 2012, pp. 9-18 (ISI IF= 0.868).

41. M. Khalil Abdullah, M. Z. Abdullah, M. A. Mujeebu, Z. M. Ariff and K. A. Ahmad, Three-Dimensional Modelling to Study the Effect of Die-Stacking Shape on Mould Filling During Encapsulation of Microelectronic Chips, IEEE Transactions on Advanced Packaging, Vol. 33 (2), May 2010, (ISI IF= 1.253). 

42. D. H. Hussein, H. Gitano-Briggs and M. Z. Abdullah, Design Analysis and Performance Prediction of the Cardiac Axial Blood Pump, Research Journal of Biological Sciences, Vol. 4 (6), pp. 637-643, 2009. 

43. D. H. Hussein, H. Gitano-Briggs and M. Z. Abdullah, Cardiac Axial Blood Pump Analysis and Performance Prediction, ASME: Journal of Medical Devices, Vol. 3, June 2009. 

44. M. K. Abdullah, M. Z. Abdullah, M.A. Mujeebu, H. Gitano, Z. M. Ariff, R. Razali and K. A. Ahmad, Three-Dimensional Modelling of Mould Filling in Microchip Encapsulation Process in Matrix Array Arrangement, ASME: Journal of Electronic Packaging, Vol. 132, March 2010, (ISI IF= 0.827). 

45. M. Abdul Mujeebu, M. Z. Abdullah and S. Ashok, Viability of Biomass Fueled Steam Turbine Cogeneration with Power Export for Asian Plywood Industry, Energy Exploration and Exploitation, Vol. 27 (3), pp. 213-224, 2009, (ISI IF= 0.271). 

46. R. M. N. Muhad, M. Z. Abdullah, A. A. Mohamad, M. A. Mujeebu, M. Z. Abu Bakar and R. Zakaria, 3-D Numerical Modeling and Experimental Investigation of Partial-Premix Type Porous Medium Burner Using LPG Fuel, Journal of Porous Media, Vol. 13 (9), 2010, (ISI IF= 1.731). 

47. M. Sri Raj Rajeswari, K.A.M. Azizli, S.F.S. Hashim, M.K. Abdullah, M. Abdul Mujeebu, M.Z. Abdullah, CFD Simulation and Experimental Analysis of Flow Dynamics and Grinding Performance of Opposed Fluidized Bed Air Jet Mill, International Journal of Mineral Processing, Vol. 98, pp. 94-105, 2011, (ISI IF= 1.3) 

48. C. Y. Khor, M. K. Abdullah, M. Z. Abdullah, M. Abdul Mujeebu, D. Ramdan, M. F. M. A. Majid, Z. M. Ariff, Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages, Heat and Mass Transfer, Vol. 46, pp. 1315-1325, 2010 (ISI IF= 0.7) 

49. M. Abdul Mujeebu, M. Zulkifly Abdullah, A. A. Mohamad, M. Z. Abu Bakar, Trends in modeling of porous media combustion, Progress in Energy and Combustion Science, Vol. 36, pp. 627-650, 2010 (ISI IF= 11.2) 

50. M. Zubair, V. N. Riazuddin, M. Z. Abdullah, R. Ismail, I. L. Shuaib, S. Abdul Hamid, K. A. Ahmad, Airflow inside the nasal cavity: visualization using computational fluid dynamics, Vol. 4 (4), pp. 657-661, August 2010 (ISI IF= 0.4). 

51. N. F. Zulkefli, F. Hussin, M. Z. Abdullah, K. A. Ahmad, Numerical investigations of flow field structure induced by sub-boundary layer vortex generators (SBVG), Int. Review of Aerospace Engineering (I.RE.AS.E), Vol. 3 (1), February 2010. 

52. M. A. Mujeebu, M. Z. Abdullah and S. Ashok, Husk-Fuelled Steam Turbine Cogeneration for a Rice Mill with Power Export- A Case Study, Energy Sources Part A: Recovery, Utilization, and Environmental Effects Volume 33 Issue 8 (2010), 724. 

53. M.K. Abdullah, M. Z. Abdullah, M. V. Ramana, C. Y. Khor, K. A. Ahmad, M. A. Mujeebu Y. Ooi, and Z. Mohd Ripin. Numerical and experimental investigations on effect of fan height on the performance of piezoelectric fan in microelectronic cooling, International Communications in Heat and Mass Transfer 36 (2009) 51–58. 

54. M.Khalil Abdullah, M. Z. Abdullah, M.A. Mujeebu, S. Kamaruddin and Z. M. Ariff , Three-Dimensional Modelling on Effect of Multi Die-Stacking Shape in Mould Filling during Encapsulation of Microelectronic Chips, IEEE Transactions on Advanced Packaging 2010; 33 (2): 438 – 446 (ISI IF: 1.086). 

55. S. Yusoff, M. Mohamed, K. A. Ahmad, M. Z. Abdullah, M. A. Mujeebu, Z. Mohd Ali, F. Idrus, Y. Yaakob, 3-D Conjugate Heat Transfer Analysis of PLCC Packages Mounted In-line on a Printed Circuit Board, International Communications in Heat and Mass Transfer 36 (2009) 813–819. 

56. C.Y. Khor, M. Z. Abdullah, M.A. Mujeebu, M. K. Abdullah and Z. M. Ariff, Three dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding, International Communications in Heat and Mass Transfer, 37 (2010) 131–139. 

57. C.Y. Khor, M. Abdul Mujeebu, M. Z. Abdullah and F. Che Ani, Finite volume based CFD simulation of pressurized flip chip underfill encapsulation process, Microelectronics Reliability 50 (2010) 98–105. 

58. R.M.N. Muhad, M.Z. Abdullah, M.A. Mujeebu, M.Z. Abu Bakar, R. Zakaria, A.A. Mohamad. Development and performance analysis of partially premixed LPG porous medium combustor, Energy Sources, Part A: Recovery, Utilization, and Environmental Effects, Vol. 33, 2011, pp. 1260-1270. 

59. M.A Mujeebu, M.Z Abdullah, M.Z. Abu Bakar, A.A. Mohamad. Development of premixed burner based on stabilized combustion within discrete porous medium, Journal of Porous Media (in press). 

60. N.F.Zulkefli, E.N.Tai, M.A. Mujeebu, M.Z.Abdullah, K.A.Ahmad, Numerical and experimental investigations of passive flow control devices on a backward facing step, International Journal of Engineering and Technology, Vol. 6, No. 2, 2009, pp. 21-29. 

61. Mazlan Mohamed, M.Z. Abdullah, M.A. Mujeebu and M. K. Abdullah, Numerical Investigation of Heat Transfer in Plastic Leaded Chip Carrier (PLCC) Packages in In-line Arrangement, Journal of Modeling, Design & Management of Engineering Systems, 5(1):11 – 22. 

62. C.Y. Khor, M.K. Abdullah, M.Z. Abdullah, M. Abdul Mujeebu, D. Ramdan, M.F.M.A. Majid, Z.M. Ariff and M.R Abdul Rahman. Numerical analysis on the effects of different inlet gates and gap heights in TQFP encapsulation process, Int. J. Heat and Mass Transfer, vol. 54, No. 9-10, 2011, pp. 1861-1870 (ISI IF= 1.943). 

63. M. K. Abdullah, B. H. Murni, M. Z. Abdullah, M. Abdul Mujeebu, F. Hussin, H. Yusoff, N.C. Ismail, K. A. Ahmad, and Z. Mohd Ripin. Heat transfer enhancement using piezoelectric fan in electronic cooling - experimental and numerical observations. ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology (in press) (ISI IF= 0.179). 

64. H. Yusoff, M. Z. Abdullah, K. A. Ahmad, M. Abdul Mujeebu. Development of flexible wings and flapping mechanism with integrated electronic control system, for MAV research. Experimental Techniques, 33(6), 2011, pp. 53-58 (ISI IF= 0.505). 

65. Mohamed H A Elnaggar, M. Z. Abdullah and M. Abdul Mujeebu. Experimental Analysis and FEM Simulation of Finned U-shape Multi Heat Pipe for Desktop PC Cooling. Energy Conversion and Management 52 (2011) 2937–2944 (ISI IF: 2.072) 

66. S. F. Shaker, M.Z. Abdullah, M. Abdul Mujeebu, K.A. Ahmad and M.K. Abdullah. Study on the Effect of Number of Film Cooling Rows on the Thermal Performance of Gas Turbine Blade. ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, 32(1), April 2012 (ISI IF= 0.179). 

67. Mohamed H A Elnaggar, M. Z. Abdullah and M. Abdul Mujeebu. Experimental investigation and optimization of heat input and coolant velocity of finned twin U-shaped heat pipe for CPU cooling. Experimental Techniques (in press) (ISI IF= 0.505). 

68. M. Abdul Mujeebu, M. Z. Abdullah, A. A. Mohamad. Development of energy efficient porous medium burners on surface and submerged combustion modes, Energy, Vol. 36, No. 8, 2011, pp. 5132-5139 (ISI IF= 3.565) 

69. D. Ramdan, C.Y. Khor, and M.Z. Abdullah. Plastic Ball Grid Array Encapsulation Process Simulation on Rheology Effect. TELKOMNIKA, Vol.9, No. 1, April 2011, pp. 29~38 

70. W. C. Leong, M. Z. Abdullah, C. Y. Khor, H. J. Tony Tan, FSI Study of the Effect of Air Inlet/Outlet Arrangements on the Reliability and Cooling Performances of Flexible Printed Circuit Board Electronics, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, 33(1), April 2013 (ISI IF= 0.179). 

71. H. J. Tony Tan and M. Z. Abdullah, Effects of Geometry and number of Hollow on the Performance of Rectangular Fins in Microchannel Heat Sinks, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, 33(1), April 2013 (ISI IF= 0.179). 

72. M. A. Mujeebu, M. Z. Abdullah and M. Zuber, Experiment and Simulation to Develop Clean Porous Medium Surface Combustor using LPG, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, 33(1), April 2013. (ISI IF: 0.179) 

73. C. Y. Khor, M. Z. Abdullah and F. Che Ani, Study on the fluid/structure interaction at different inlet pressures in molded packaging, Int. J. Microelectronic Engineering, 88(10), 2011, pp. 3182-3194. 

74. C.Y. Khor, M.Z. Abdullah, H.J. Tony Tan, W.C. Leong, D. Ramdan, Investigation of the fluid/structure interaction phenomenon in IC packaging, Int. J. Microelectronic Reliability (In press). 

75. Abdullah MK, Ismail NC, Abdullah MZ, Mujeebu MA, Ahmad KA, Ripin Z. Mohd (2011) Effects of Tip Gap and Amplitude of Piezoelectric Fans on the Performance of Heat Sinks in Microelectronic Cooling. Heat and Mass Transfer (In Press) (ISI IF: 0.7) 

76. W.C. Leong, M.Z. Abdullah and C.Y. Khor, Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on Mechanical Performance, Microelectronics Reliability Volume 52, Issue 4, April 2012, Pages 744-756. (ISI IF: 1.101) 

77. W. C. Leong, M. Z. Abdullah, M. Abdul Mujeebu, “Flow induced deflection and stress on flexible printed circuit board (FPCB) in fan-cooled electronic systems: FSI approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2 (4), April 2012 (ISI IF: 1.086) 

78. Riazuddin VN, Zubair M, Abdullah MZ, Ismail R, Shuaib IL, Abdul Hamid S, Ahmad KA (2011) Numerical Study of Inspiratory and Exploratory Flow in a Human Nasal Cavity, Journal of Medical and Biological Engineering, Volume 31, No. 3, pp 201-206 (ISI IF: 0.42). 

79. R.M.N. Muhad, M.Z. Abdullah, M.A. Mujeebu, M.Z.A. Bakar, R. Zakaria, A.A. Mohamad, The development and performance analysis of partially premixed LPG porous medium combustor, Energy Sources, Part A: Recovery, Utilization and Environmental Effects, Volume 33, Issue 13, January 2011, pp. 1260-1270 (ISI IF: 0.843). 

80. M.S.R Rajeswari, K.A.M. Azizli, S.F.S. Hashim, M.K. Abdullah, M.A. Mujeebu, M.Z. Abdullah, CFD simulation and experimental analysis of flow dynamics and grinding performance of opposed fluidized bed air jet mill, International Journal of Mineral Processing, Volume 98, Issue 1-2, 17 January 2011, Pages 94-105 (ISI IF: 1.082). 

81. C. Y. Khor, M. Z. Abdullah, W. C. Leong, Fluid/structure interaction analysis of the effects of solder bump shapes and input/output counts on moulded packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2 (4), April 2012 (ISI IF: 1.086). 

82. D. Ramdan, M. Z. Abdullah, and M. A. Mujeebu, W. K. Loh, C. K. Ooi, R. C. Ooi, FSI simulation of wire sweep PBGA encapsulation process considering rheology effect, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2 (4), April 2012 (ISI IF: 1.086). 

83. C.S. Lau, M.Z. Abdullah, F. Che Ani, Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process, Soldering & Surface Mount Technology, Vol. 24 (2), pp. 77-91, 2012. (IF: 0.659) 

84. C.S. Lau, M.Z. Abdullah, F. Che Ani, Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method, Int. J. of Microelectronics Reliability, Vol. 52 (6), 2012, pp. 1143-1152 (ISI IF: 1.101). 

85. C.S. Lau, M.Z. Abdullah, F. Che Ani, Three-Dimensional Thermal Investigations at Board Level in a Reflow Oven Using Thermal-Coupling Method, Soldering & Surface Mount Technology, Vol. 24 (3), 2012, pp. 167-182 (IF: 0.659). 

86. C.Y. Khor, M.Z. Abdullah and M. Abdul Mujeebu, (2012) Influence of Gap Height in Flip Chip Underfill Process with Non-Newtonian Flow between Two Parallel Plates, ASME Journal of Electronic Packaging, 134, March 2012, pp. 011003-1-011003-5 (IF: 0.564). 

87. C.Y. Khor, M.Z. Abdullah, Z.M. Ariff and W.C Leong, Effect of stacking chips and inlet positions on the void formation in the encapsulation of 3D stacked flip-chip package, International Communication in Heat and Mass Transfer, Vol. 39, 2012, pp. 670-680 (ISI IF: 1.609) 

88. C. Y. Khor, M. Z. Abdullah, Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation, Maejo Int. J. of Science and Technology, Vol. 6(2), 2012, pp. 159-185. (ISI IF: 0.2) 

89. D. Ramdan, C.Y. Khor , M. Abdul Mujeebu, M. Z. Abdullah, W. K. Loh and C. K. Ooi, FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, (Accepted on 13 October 2011). (IF: 0.179) 

90. D. Ramdan, M.Z. Abdullah, N. Md. Yusop, Effects of Outlet Vent Arrangement on Air Traps in Stacked-Chip Scale Package Encapsulation, International Communications in Heat and Mass Transfer, Vol. 39, 2012, pp. 405-413 (ISI IF: 1.609) 

91. H.J. Tony Tan, M.Z. Abdullah, M.A. Mujeebu, Effects of Geometry and number of Hollow on the Performance of Rectangular Fins in Microchannel Heat Sinks, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, (Accepted on 22 June 2011). (IF: 0.179) 

92. H.J. Tony Tan, M.Z. Abdullah, Effects of horizontal/vertical fin tip gaps on microchannel heat sinks performance in electronic cooling, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, (Accepted on 9 March 2012). (IF: 0.179) 

93. M. H. A. Elnaggar, M. Z. Abdullah, M. A. Mujeebu, Characterization of working fluid in vertically mounted finned U-shape twin heat pipe for electronic cooling, Int. J. of Energy Conversion and Management, (Accepted on 23 March 2012) (ISI IF 2.072). 

94. M. K Abdullah, N. C Ismail, M. Abdul Mujeebu, M. Z Abdullah, K. A Ahmad, Muhamad Husaini, M. N. A. Hamid (2011) Optimum Tip Gap and Orientation of Multi-Piezofan for Heat Transfer Enhancement of Finned Heat Sink in Microelectronic Cooling. International Journal Heat and Mass Transfer (Accepted) (ISI IF: 1.899) 

95. A. H. Ali, N. M. Yusop, M. Z. Abdullah, Validation of Three Dimensional Film Cooling Modelling on Convex Surface for Gas Turbine Blade, Int. Com. Heat and Mass Transfer (Accepted 25 March, 2012) (IF: 1.609). 

96. D. Ramdan, C.Y. Khor , M. Abdul Mujeebu, M. Z. Abdullah, W. K. Loh and C. K. Ooi, FSI Analysis of Wire Sweep in Encapsulation Process of Plastic Ball Grid Array Packaging, ISI Bilimi ve Teknigi Dergisi-Journal of Thermal Science and Technology, (Accepted on 13 October 2011). (ISI IF: 0.179) 

97. C. Y. Khor, M. Z. Abdullah, W. C. Leong, Visualization of Fluid/structure interaction in IC Encapsulation, IEEE Transactions on Components, Packaging and Manufacturing Technology, (Accepted on 4 May, 2012) (ISI IF: 1.086). 

98. W. C. Leong, C. Y. Khor, M. Z. Abdullah, E. S. E. Ong, Study on the fluid-structure interaction of flexible printed circuit board electronics in the flow environment, IEEE Transactions on Components, Packaging and Manufacturing Technology, (Accepted on May, 2012) (ISI IF: 1.086). 

99. M. C. Ting, M. A. Mujeebu, M. Z. Abdullah, M. R. Arshad, Numerical study on hydrodynamic performance of shallow underwater glider platform, Indian J. of Marine Sciences, Vol. 41(2), April 2012, pp. 124-133 (ISI IF: 0.422). 

100. M. Z. Abdullah, M. A. Mujeebu, H. Gitano, Y. Yaakob and M. K. Abdullah, Transient Natural Convection in a Rectangular Cavity Filled with Porous Medium Heated Discretely at Vertical Wall, J. of Engineering Science, Vol. 7, 2011, pp. 1-13. 

101. M. Zubair, M. Z. Abdullah, Suzina A. H, I.Rushdan, I.L. Shuaib, K.A. Ahmad, “A critical overview of CFD modeling in nasal airflow”, Journal of Medical and Biological Engineering. J. Med. Biol. Eng., 32 (2), 2012, pp. 77-84 (ISI IF: 0.4) 

102. K.A. Ahmad, M.Z. Abdullah and J.K. Watterson, “Numerical modelling of a pitching airfoil”, Jurnal Mekanikal, Vol. 30, June 2010, pp. 37-47. 

103. N.F.Zulkefli, F. Hussin, M.Z.Abdullah, K.A.Ahmad, “Numerical Investigations of Flow Field Structure Induced by Sub-Boundary Layer Vortex Generators (SBVG)”, International Review of Aerospace Engineering (IREASE), Vol. 3 (1), February 2010, ISSN 1973-7459. 

104. C. Y. Khor, M. Z. Abdullah, F. Che Ani, “Underfill Process for Two Parallel Plates and Flip Chip Packaging”, International Communications in Heat and Mass Transfer (Accepted 28 June 2012) (ISI IF: 1.892) 

105. N. M. Yusop, A. H. Ali, M. Z. Abdullah, Computational Prediction Into Staggered Film Cooling Holes on Convex Surface of Gas Turbine Blade, Int. Com. Heat and Mass Transfer (Accepted 28 June, 2012) (IF: 1.609). 

106. C. Y. Khor, M. Z. Abdullah, Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology, Simulation Modelling Practice and Theory, (Accepted on 11 July, 2012) (ISI IF: 0.4). 

PAPERS IN INTERNATIONAL/LOCAL CONFERENCES 

1. Fraser, S. M., and Abdullah, M. Z., ‘Experimental Investigation of an Improved Cyclone Dust Separator’, 7th. International Conference on Laser Anemometry Advances and Applications, Germany, September 8-12, 1997. 

2. Fraser, S. M., and Abdullah, M. Z., ‘LDA Measurement on Modified Cyclone’. Laser Anemometry ASME, 1995, Vol. 229, pp. 395-403.

3. Fraser, S. M., and Abdullah, M. Z., ‘LDA Applied to Cyclone Separator’, UKALA Colloquium, University of Strathclyde, Glasgow, 1994. 

4. M. Z. Abdullah and T. K. Kuan ‘Thermal Contact Resistance with Different Surface Roughness’. 4th. ISHMT-ASME Heat and Mass Transfer Conference, Pune, January 12-14, 2000. 

5. M. Z. Abdullah and K. M. Siddiqui ‘Hydrodynamics of Low Grade Fuel in Fluidized Bed’. Canadian Journal of Chemical Engineering (Communicated – submitted on July 2000). 

6. K. O. Lim, Zainal Alimuddin Zainal Alauddin, Ghulam Abdul Quadir and Mohd Zulkifly Abdullah ‘Energy Productivity of Some Plantation Crops in Malaysia and The status od Bioenergy Utilization’, Proceedings of the World Renewable Energy Congress ’99 Malaysia, Kuala Lumpur, June 8-11, 1999. 

7. A. Jaafar, Z. Husain, Z. Mohd Ripin, M. Z. Abdullah and R. Ahmad ‘Aerodynamic Characteristics of Canard/Wing of Low Speed Eagle Aircraft’, Int. Conference of Advanced Strategic Technology, Kuala Lumpur, August 14-17, 2000. 

8. W. S. Islam, Z. Husain and M. Z. Abdullah, ‘Aerodynamics of Proton Car’, IEM Bulletin (JURUTERA), August 2001. 

9. M. Z. Abdullah, C. Y. Lim, S. H. Loo and Z. A. Zainal Alauddin, ’Measurement and Prediction on Natural Convection from Isothermal and Non-Isothermal Vertical Surface’, 6th. ISHMT-ASME Heat and Mass Transfer Conference, Calcutta, January 3-4, 2002. 

10. M. Z. Abdullah, Y. C. Yau and Z. A. Zainal Alauddin, ’Transient Thermal contact resistance’, 6th. ISHMT-ASME Heat and Mass Transfer Conference, Calcutta, January 3-4, 2002. 

11. Z. A. Zainal, S. Bari and M. Z. Abdullah, ’Experimental Characterization of a Batch Feed Biomass Gasifier System for Internal Combustion Engines’, 4th International Conference on Mechanical Engineering, Dhaka, December 26-28, 2001. 

12. T. C. Yap, M. Z. Abdullah, Z. Husain, Z. Mohd Ripin and R. Ahmad, ’The Effect of Turbulence Intensity on the Aerodynamic Performance of Airfoils’, 4th International Conference on Mechanical Engineering, Dhaka, December 26-28, 2001. 

13. M. Z. Abdullah, Z. A. Zainal, K. N. Seetharamu, ‘LDA Measurement on Laminar Natural Convection from Isothermal and Non-Isothermal Wall’, 2nd National Conference in Civil Engineering (AWAM 2001), February 5-8, 2002 (Abstract Submitted 29/9/01) 

14. M. Z. Abdullah, T. C. Yap, Z. Husain, Z. Mohd Ripin and R. Ahmad, ‘The effect of turbulence intensity on the aerodynamic performance of NACA airfoil at low Reynolds number using experimental and computational methods’, National Conference on Aerodynamics and Related Topics 2001, USM Nibong Tebal, Penang. 

15. Z. Husain, T. C. Yap and M. Z. Abdullah, ‘CFD Simulation and Aerodynamics of Low Speed Tandem Wing Design Aircraft’, National Conference on Aerodynamics and Related Topics 2001, USM Nibong Tebal, Penang. 

16. F. Alfissima, B. Basuno and M. Z. Abdullah, ‘Design and Development of an Unmanned Aerial Vehicle’, National Conference on Aerodynamics and Related Topics 2001, USM Nibong Tebal, Penang. 

17. E. Rachman, F. Alfissima and M. Z. Abdullah, ‘Application of Numerical Method for Simulating Steady-State, Trimmed Flight Conditions of The Remotely Piloted Vehicle’, 2nd World Engineering Congress, Kuching, Sarawak, July 22-25, 2002. 

18. L. K. Oon, G. A. Quadir, K. N. Seetharamu, P. A. Aswatha Narayana, M. Z. Abdullah, I. A. Azid and Z. A. Z. Alauddin, ‘Optimization of Thermodynamic Cycles for Gas Turbines Using Genetic Algorithms’, 6th Asia-Pacific International Symposium on Combustion and Energy Utilization, Kuala Lumpur, May 20-22, 2002. 

19. Baljit Singh, K. N. Seetharamu, Mohd Zulkifly Abdullah, Varun Jeoti, P. C. Sharma, Electrical characterization of electronic packages using the asymptotic waveform evaluation (AWE), The 6th Int. Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, Dec. 5-7, 2007. 

20. A. Kamal Ismail, M. Najhan Awang and M. Z. Abdullah, Experimental investigation on the thermal contact resistance for Li-ion cell battery, The 6th Int. Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, Dec. 5-7, 2007 

21. Pradeep Hedge, K. N. Seetharamu, P. A. Aswatha Narayana, Ghulam Abdul Quadir, Mohd Zulkifly Abdullah and Hj. Zainal Alimuddin Zainal Alauddin, Single and double stack micro-channel heat sinks with two-phase flow, The 6th Int. Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, Dec. 5-7, 2007 

22. Y. J. Teng, K. N. Seetharamu, A. Mohd Zulkifly and Z. A. Zainal Alimuddin, Simulation of micro compact heat exchanger using FEM modeling, The 6th Int. Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, Dec. 5-7, 2007 

23. Wong Shaw Fong, K. N. Seetharamu, Mohd Zulkifly, Bharatham Logendra, Torresola Javier, Chen Chee Koang, Tay, Martin Tiong We, The 6th Int. Conference on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, Dec. 5-7, 2007 

24. M. A. Ismail and M. Z. Abdullah, Simulation and experimental investigation on microelectronic heat sink, International Conference on Science and Technology (ICSTIE ’06), 8-9 December 2006, Penang. 

25. F. Idrus, M. K. Abdullah and M. Z. Abdullah, A numerical study of two-dimensional natural convection in a differentially heated enclosure, International Conference on Science and Technology (ICSTIE ’06), 8-9 December 2006, Penang. 

26. M. R. M. Nawi, M. Z. Abdullah, Z. A. Z. Alauddin, M. Z. Abu Bakar and R. Zakaria, Study on porous medium burner, International Conference on Science and Technology (ICSTIE ’06), 8-9 December 2006, Penang. 

27. H. Yusoff, M. Z. Abdullah and Z. Mohamed Kassim, PIV measurement of vortex shedding between two cylinders in tandem arrangement, International Conference on Science and Technology (ICSTIE ’06), 8-9 December 2006, Penang. 

28. M. K. Abdullah, M. Z. Abdullah, S. Kamaruddin, Z. M. Ariff, P. Hussin, J. J. Anthony, H. Haroon, M. Manikam, Three-dimensional mould flow in integrated chips (IC’s) encapsulation, Conference on Applied Science (CAS 2006), 13-14 June 2006, Kuala Lumpur. 

29. H. Yusoff, M. Z. Abdullah and Z. Mohamed Kassim, PIV measurement of vortex shedding between two cylinders in tandem arrangement, Conference on Applied Science (CAS 2006), 13-14 June 2006, Kuala Lumpur. 

30. M. A. Ismail and M. Z. Abdullah, Free stream cooling of the commercial micro electronic heat sink, Int. Conference on Energy and Environment (ICEE2006), 28-29 August 2006, Kajang. 

31. A. K. Ismail, M. Z. Abdullah, A. A. Aljubouri, J. Abdul Aziz, Thermal contact resistance of hard and soft mating materials, 17`" Int. Symposium on Transport Phenomena (ISTP-17), 4-8 September 2006, Toyoma, Japan. 

32. M. K. Abdullah, M. Z. Abdullah, S. Kamaruddin, Z. M. Ariff, P. Hussin, J. J. Antony, H. Haroon, M. R. Saad and M. Manikam, Three-dimensional mold flow in stacked-chip scale packages (S-CSP), 31’t Int. Conference on Electronics, Manufacturing and Technology (IEMT2006), 8-10 November 2006, Petaling Jaya. 

33. Z. Mohd Ali, M. Z. Abdullah and C. Retnasamy, Aerodynamic performance of a piloted vehicle, International Conference on Science and Technology (ICSTIE ’06), 8-9 December 2006, Penang. 

34. M. K. Abdullah and M. Z. Abdullah, Three-dimensional mould flow in encapsulation process in microelectronic devices, Field-wise seminar on Mechanical and Aeronautics Engineering (AUN/SEED Net Program), 24-25 February 2006, Bandung. 

35. Hegde Pradeep, Seetharamu, K.N., Aswatha Narayana, P.A., Quadir, G. A., Abdullah M.Z. and Goh, T.J. (2004). Analysis of Two Phase Micro channel Heat Sinks for High Heat Flux Electronics Cooling. 10th International Workshop on Thermal investigations of ICs and Systems, France, 29 Sept-1 Oct, pp. 235-239. 

36. Hegde Pradeep, Seetharamu, K.N., Aswatha Narayana, P.A., Zulkifly Abdullah, Goh, T. J. (2004). Single and Double Stack Micro channel Heat Sinks with Two-Phase Flow. 6th International Conference on electronic Material and Packaging (EMAP), Malaysia (Penang), 5-7 Dec, pp. 379-384. 

37. Hegde Pradeep, Seetharamu, K.N., Aswatha Narayana, P.A., Zulkifly Abdullah. (2004). Thermal Analysis of Single Layer Counter Flow Heat Sinks with Two Phase Flow. 6th Electronic Packaging Technology Conference (EPTC), Singapore, 8-10 Dec. pp. 559-563 

38. Hegde Pradeep, Seetharamu, K.N., Abdullah, M.Z., Hassan, A.Y. (2006). Multi-Stack Micro channel Heat Sinks with Counter Flow Arrangement for Efficient Electronics Cooling. 18th National & 7th ISHMT-ASME Heat and Mass Transfer Conference, Guwahati, India, Jan. 4 - 6, 2006. 

39. Hegde Pradeep, Abdullah, M.Z., Hassan, A.Y., Rajagopal, M.S. and Seetharamu, K.N. (2006). Finite Element Simulation of Multi-Stack Micro channel Heat Sinks with Parallel and Counter Two Phase Flow. 18th National & 7th ISHMT-ASME Heat and Mass Transfer Conference, IIT Guwahati, India, Jan. 4 - 6, 2006. 

40. M. Z. Abdullah, Y. Yaakob, F. Idrus, and M. K. Abdullah, Natural Convection of Discrete Heating in a Cavity Filled by porous Media for Different Aspect Ratio, The 9th Int. Symposium on Electronic Materials and Packaging (EMAP2007), Daejeon, Korea, Nov. 19-22, 2007 

41. Z. Mohd Ali, S. Yusoff and M. Z. Abdullah, Experimental and Numerical Investigations of Two Inline PLCC Packages Horizontal Mounted, The 9th Int. Symposium on Electronic Materials and Packaging (EMAP2007), Daejeon, Korea, Nov. 19-22, 2007 

42. A. K. Ismail, M. Z. Abdullah, Shahril Nizam Soid, H. Ideris, M. R. M. Yunus and M. Z. Latiff The development of test facility to study on fluid cooling system for automotive, International Conference on Engineering and Technology (ICET ’07), 11-13 December 2007, Kuala Lumpur. 

43. Mazlan Mohamed, M. A. Ismail and M.Z. Abdullah, Three dimensional of CFD conjugate analysis of packages in array orientation, Conf. Product & Design 2007, Penang, Dec. 10-12, 2007. 

44. M. Rozi M. Nawi, M. Z. Abdullah, Z. A. Z. Alauddin, M. Z. A. Bakar, R. Zakaria, Steady state and transient analysis of low NOx porous medium burner, Conf. Product & Design 2007, Penang, Dec. 10-12, 2007. 

45. M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu and Z. M. Ariff, Numerical study on the effect of multi stacking-die arrangement to the mould filling encapsulation process, Conf. Product & Design 2007, Penang, Dec. 10-12, 2007. 

46. Shamsul Bahari Azraai, Mohd Zulkifly and Mohd Yusoff Sulaiman, Performance of louvered fins compact heat exchangers, Conf. Product & Design 2007, Penang, Dec. 10-12, 2007. 

47. M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu and Z. M. Ariff , “CFD Challenges in Multi Stacked Microchips During Encapsulation Process”, Key note paper, Proceedings of Energy- 2008, Jan 31-Feb 01, 2008, NIT Calicut, Kerala, India, pp. 02-16. 

48. Mazlan Mohamed, M.Z. Abdullah, M.A. Mujeebu and M. K. Abdullah, Three Dimensional CFD Simulation for Eight PLCC Packages Mounted In Line on a Printed Circuit Board, Proc. Mechanical Engineering research Colloquium(MERC’08), Universiti Sains Malaysia, 27-28 Aug. 2008, Pages 80-89. 

49. S.F. Shaker, M.Z. Abdullah, M.A. Ismail, M. K. Abdullah, M.A. Mujeebu, Modeling of Gas Turbine Blades for Different Cooling Arrangement, Proc. Mechanical Engineering research Colloquium(MERC’08), Universiti Sains Malaysia 27-28 Aug. 2008, Pages 07-13. 

50. H. Yusoff, M. Z. Abdullah, Z. M. Kassim, M. A. Mujeebu, and M. Khalil, Study of Vortex Shedding between Two Cylinders in Tandem Arrangement using Flexible PIV Technique, Proc. International Conference on Micro electro mechanical Systems (MEMS 08), Anjuman Engineering College, Bhatkal, S.India, 22-23 Oct. 2008. 

51. M.K. Abdullah, M. Z. Abdullah, S.F. Wong, C. Y. Khor, Y. Ooi, K. A. Ahmad, Z. Mohd Ripin and M. A. Mujeebu, Effect of piezoelectric fan height on flow and heat transfer for electronics cooling applications, Proc. 10th International Conference on Electronic Materials and Packaging EMAP 2008, 22-24 Oct. 2008, Taipei, Taiwan, pp.165-170. 

52. M.Abdul Mujeebu, M.Z Abdullah, M.Z. Abu Bakar, A.A. Mohamad, Development of mesoscale premixed porous medium burners for household applications, Proc. Mechanical Engineering research Colloquium(MERC’09), Universiti Sains Malaysia 30 Sep – 02 Oct. 2009, Pages 01- 06. 

53. C.Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu, F. Che Ani, Numerical simulation of solder ball effect on capillary flow under-fill process in flip chip packaging, Proc. Mechanical Engineering research Colloquium(MERC’09), Universiti Sains Malaysia 30 Sep – 02 Oct. 2009, Pages 25- 31.

AVailable PhD / MSc titles



1. Fluid/structure interaction (FSI) in the molded underfill (MUF) encapsulation process (supported by Intel Grant) 
2. FSI on the wire sweep phenomena during the encapsulation process of stacked-chip packages (supported by Intel Grant) 
3. Effects of solder ball arrangement on the reflow soldering process 
4. Study of the piezoelectric fan cooling performance on the ultra light LED modules 
5. Application of heat pipe in the high power electronic devices 
6. Development of porous medium burner for household applications