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School of Mechanical Engineering

THERMiCs

Thermal engineering, research & modeling in intelligent cooling systems (THERMiCs)

THERMiCs is a multidisciplinary research group advancing thermal engineering through heat transfer science, intelligent control, and advanced simulation. The group tackles thermal challenges in high-density electronics, energy storage, and compact devices where conventional cooling falls short. Using tools like CFD, FSI, and AI-driven optimization, THERMiCs develops sustainable, high-performance thermal solutions that enhance reliability and efficiency in next-generation technologies. Its work supports both industrial innovation and long-term energy sustainability.

Group members

Professor Ir. Dr. Mohd. Zulkifly Bin Abdullah
Professor Ir. Dr. Mohd. Zulkifly Bin Abdullah
Chairman

Associate Professor Ir. Dr. Mohd Azmi Bin Ismail
Associate Professor Ir. Dr. Mohd Azmi Bin Ismail
Head

 

 




Associate Professor Dr. Yu Kok Hwa
Associate Professor Dr. Yu Kok Hwa
Member
 
Ir. Dr. Ahmad Fikri Bin Mustaffa
Ir. Dr. Ahmad Fikri Bin Mustaffa
Member
 
 

Research ACTIVITIES



Selected publications

  1. Salih M.M.M., Ismail M.A., Alomar O.R. Al-Attab K.A.M., Energy, exergy, economic and environmental analysis of PV-assisted wavy solar air heater integrated with phase change material and air preheating, 2026, 298(2):131076.
  2. Salih M.M.M., Ismail M.A., Alomar O.R., Al-Attab K.A.M., Impacts of collector geometry on performance of solar air heater system under forced and natural air circulation processes, 2026.
  3. Talib A.J., Yu K.H., Eidan A.A., Chan K.W., Hatif I.H., Heat pipe integration in vapour compression refrigeration: Refrigerant-side enhancement, air-side heat recovery, and electronics thermal management, Renewable and Sustainable Energy Reviews, 2026, 230:116688
  4. Chin I, Loh W.K., Kee S.C., He Y., Abdullah M.Z., Tsuriya M., Experimental method to measure high-temperature hygroscopic swelling in epoxy mold compounds and dielectric build-up films, Journal of Electronic Packaging, 2025, 147(1):011009
  5. Ramalingam K., Abdullah M.Z., Abas M.A., Yu K.H., Kamarudin R., Rahman M.R.A., Wong S.F., Lam P.K., Cheah B.E., Semiconductor wafer in electronics packaging: a hybrid investigation with ML and experimental insights, The International Journal of Advanced Manufacturing Technology, 2025, 142:1765-1781.
  6. Sun P., Ismail M.A., Mustaffa A.F., Metamodel-based design optimization for heat transfer enhancement of finned heat sinks, International Journal of Thermal Sciences, 2025, 214:109896.
  7. Munas F.R., Khai L.C., Yu K.H., Mustaffa A.F., Muzathik A.M., Ismail M.A., Thermal performance comparison between bias acoustic liner and acoustic linear for aircraft anti-icing, Journal of Mechanical Science and Technology, 2025, 39:375-386.
  8. Soo Y.H., Yu K.H., Ismail M.A., Heat transfer enhancement of microchannel heat sink with water-droplet grooves: geometrical and grooves arrangement effects. Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2025, 47(11):568
  9. Talib A.J., Yu K.H., Sulaiman A.D., Hassan M.S., Hawas M.N., Raheem A.T., Wong K.Y., Hatif I. H., Active mixing strategies for energy-efficient water dispensers: comparative experimental study of impeller and bubble injection in hot climates, Thermal Science and Engineering Progress, 2025, 65:103917
  10. Asoul M.B., Yu K.H., Al-attab K.A., Ismail, M.A., Puay H.T., Numerical investigation on heat transfer enhancement of graphene coated circular pin fin, Thermal science, 2025, 29(6B):4703-4714.
  11. Amin A.M., Hamzah W.A.W., Ismail M.A., Effect of diameter, twist angle, and blade count on the thermal-hydraulic performance of a decaying twisted swirler, Case Studies in Thermal Engineering, 2023, 50:103513.
  12. Tan S.A., Yu K.H., Abdullah M.Z., Heat transfer analysis on wafer annealing process in semiconductor multi-wafer furnace using CFD simulation, Journal of Mechanical Science and Technology, 2022, 36:3143-3151.
  13. Choong J.Y., Yu K.H., Abdullah M.Z., Numerical assessment of heat transfer performance of double-layered oblique fins microchannels heat sink with Al2O3 nanofluid, Thermal Science, 2021, 26(1B):477-488.
  14. Ahmad, M.I., Aziz ,M.S.A., Abdullah M.Z., Salleh M.A.A.M., Ishak M.H.H., Rahiman W., Nabialek M., Investigations of infrared desktop reflow oven with FPCB substrate during reflow soldering process, Metals, 2021, 11(8):1155.
  15. Narato P., Wae-hayee M., Abdullah M.Z., Nuntadusit C., Effect of pin inclination angle on flow and heat transfer charateristics for a row of pins in a flow channel, International Communication in Heat and Mass Transfer, 2020, 110:104396.
Poster